VOLUME 19 NUMBER 2 (July to December 2026)

Fabrication and characterization of hexagonal boron nitride/polypropylene composites using maleic anhydride compatibilizer for microelectronic applications

This work investigated composites prepared using a polypropylene (PP) matrix and hexagonal boron nitride (hBN) filler for microelectronic applications. The influence of filler loading (10–40 wt%) and compatibilization using maleic anhydride-grafted polypropylene (MAPP) was studied. MAPP-modified composites showed improved hBN dispersion and interfacial compatibility with the PP matrix, as verified by SEM images. Experimental results showed that hBN addition increased density, void content, and water absorption; however, MAPP reduced the increases in void content and water uptake. Tensile and flexural strengths reached maxima at approximately 25 wt% hBN, whereas compressive strength and hardness continued to increase with filler loading. Thermal conductivity increased markedly with hBN content, while the coefficient of thermal expansion decreased. At 40 wt% hBN with MAPP, thermal conductivity reached approximately 1.85 Wm-1K-1, corresponding to approximately 6.2 times the thermal conductivity of neat PP. Dielectric properties showed marginal increases with filler loading but remained within ranges considered suitable for potential microelectronic applications. Overall, the developed PP/hBN/MAPP composites demonstrate strong potential for thermal management in microelectronics.